SK hynix outlines a future of AI memory built through design-stage collaboration

SK hynix presented a portfolio spanning AI servers, PCs and mobile devices at SEDEX 2026 in Seoul, while outlining a plan to collaborate with customers on memory solutions from the design stage of new architectures.

The company is exhibiting at SEDEX 2026, the 28th Semiconductor Exhibition, at COEX from the 14th through the 16th. Under the concept “RUN,” or “Unstoppable AI Journey,” its large, track-shaped booth arranges its technology vision and products along a visitor route.

Working with customers from the design stage

SK hynix identified its ability to provide solutions that respond quickly to customer needs as a key strength amid rapid and uncertain changes in AI. On the first day of the event, Ahn Hyun, the company’s head of development, delivered a keynote on the direction of memory technology.

“Going forward, we need to go beyond supplying finished products and work together to devise the memory solutions needed from the design stage of new architectures,” Ahn said. He added that SK hynix would expand custom products tailored to specific customer needs across every memory tier and build the capacity to respond quickly to problems in the field.

Standardization was also discussed at a JEDEC forum. Lim Kyung-sun, an SK hynix technical leader, explained the background and concept behind LPDDR6-PIM, which combines low-power DRAM with computing functions, and shared directions for future memory standards.

Products for AI infrastructure, PCs and mobile devices

The center of the exhibition brought together HBM (high-bandwidth memory), a key component in AI computing, and products for servers, PCs and mobile devices. Beside a display tracing the development of HBM, the company placed NVIDIA’s Vera Rubin Superchip and an HBM wafer bearing the signature of CEO Jensen Huang to illustrate the global partnership.

Server products on display included the 256GB 3DS RDIMM, optimized for AI workloads; the high-bandwidth 128GB MRDIMM; and the 64GB RDIMM, which SK hynix described as the world’s first to use a 10-nanometer-class sixth-generation (1c) process. NAND products included eSSDs supporting direct liquid cooling (DLC) and the PS1101 E3.S 7.5mm, the company’s first QLC-based product, which it presented as a demonstration of its high-performance memory technology for data centers.

For PCs and mobile devices, the lineup included the next-generation CSODIMM memory module, LPDDR5X, GDDR7 and LPDDR6 DRAM, as well as NAND products built to the latest specifications, including UFS 5.0. The company said these DRAM products maximize high-performance and low-power characteristics.

Social initiatives and future experiences

Alongside its technology, SK hynix presented examples of using AI to create social value. They included Happy AI Study Lab, which aims to address gaps in AI education in local communities, and operation of All Win Peak, a program supporting a handball team for people with developmental disabilities.

The Senior AI Memory Care Project helps older people manage cognitive health through an emotional-care service in which they write illustrated diaries while conversing with generative AI. SK hynix shared that about 600 people took part this year in Icheon and Gwangju. Visitors could also experience AI drawing bots and humanoid robots as examples of future applications of memory technology.

Source: news.skhynix.co.kr